This product primarily employs the synergistic wetting principle of organic coupling-inorganic nanoparticles, utilizing glass microstructure bonding cross-linking technology. After undergoing bonding and cross-linking chemical treatment, the glass surface acquires a transparent nano-clean coating. This coating bonds with the glass surface microstructure, providing reliable adhesion that reduces the adhesion of dust and other contaminants to the photovoltaic module glass surface. Simultaneously, the glass surface becomes easier to clean, enhancing the maintenance efficiency of solar panels and improving power generation efficiency.

Thermal conductive sealants are a class of polymeric composite materials that simultaneously possess high thermal conductivity and structural sealing properties. Primarily used in electronics, new energy, and other fields, they address the heat dissipation needs of thermal components and gap protection requirements, filling the technical gap where pure thermal conductive materials (such as thermal grease) lack sealing capability and pure sealants lack thermal conductivity. Thermal sealants primarily consist of three major systems, with each component working synergistically to achieve dual functionality: “thermal conductivity + sealing.” The core application of thermal sealants lies in enclosed or semi-enclosed spaces, simultaneously facilitating heat dissipation and gap protection.

Thermal interface material is a flexible polymer composite formed by the synergistic interaction of a polymer matrix (such as silicone or polyurethane) with highly thermally conductive fillers (boron nitride, aluminum oxide, carbon nanotubes) to achieve efficient heat transfer and stress relaxation. Above 50°C, it triggers thermal network restructuring, boosting thermal conductivity by 38%. Recommended application method: screw pump dispenser with controlled pressure of 90-120 psi for uniform coating thickness of 0.1-1mm.

Thermal grease: A critical thermal interface material designed to fill microscopic gaps between heat-generating components (such as CPUs and GPUs) and heat sinks in electronic devices, enhancing cooling efficiency through effective heat transfer. Temperature range: -60°C to 230°C Long-term stability Certified compliant with RoHS and GB/T 26572 standards, ensuring absence of harmful substances including lead, mercury, and hexavalent chromium.